BS EN 27436-1992 一字槽凹端紧定螺钉
时间:2024-05-08 14:20:18 来源: 标准资料网 作者：标准资料网 阅读：9233
【英文标准名称】:Slottedsetscrewswithcuppoint
【原文标准名称】:一字槽凹端紧定螺钉
【标准号】:BSEN27436-1992
【标准状态】:现行
【国别】:英国
【发布日期】:1992-10-15
【实施或试行日期】:1992-10-15
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:螺钉;尖端(紧固件);螺距;名称与符号;尺寸;ISO米制螺纹;圆形;紧固件;定位螺钉;角(几何学);螺纹紧固件;开槽;无头紧固件
【英文主题词】:Acceptancespecification;Cuppoint;Deliveryconditions;Designations;Dimensions;Fasteners;Grubscrews;Materials;Screws(bolts);Slots;Slottedscrews;Slotted-headfasteners;Specification(approval);Specifications;Threadforms;Threads;Tolerances(measurement);Weights
【摘要】:SpecifiescharacteristicsofslottedsetscrewswithcuppointandthreadsizesM1.6andM12inclusiveandproductgradeA.
【中国标准分类号】:J13
【国际标准分类号】:21_060_10
【页数】:12P.;A4
【正文语种】:英语
【英文标准名称】:Circuit-breakersforequipment(CBE);Amendment2
【原文标准名称】:设备用断路器(CBE).修改件2
【标准号】:IEC60934AMD2-1997
【标准状态】:作废
【国别】:国际
【发布日期】:1997-03
【实施或试行日期】:
【发布单位】:国际电工委员会(IEC)
【起草单位】:IEC/SC23E
【标准类型】:()
【标准水平】:()
【中文主题词】:电气工程;断路器试验;机械传动系统;开关;断路器;电路;手控;电气设备
【英文主题词】:circuitbreakers;circuits;circuitbreakingtests;manualoperation;electricalengineering;switches;electricalequipment;mechanicaltransmissionsystems
【摘要】:
【中国标准分类号】:K31
【国际标准分类号】:29_120_40;33_100
【页数】:7P;A4
【正文语种】:英语
【英文标准名称】:Printedboardsandprintedboardassemblies-Designanduse-Part5-8:Attachment(land/joint)considerations-Areaarraycomponents(BGA,FBGA,CGA,LGA)
【原文标准名称】:印制板和印制板组件.设计和使用.第5-8部分:附件(结合区/接头)考虑要素.区域阵列组件(BGA,FBGA,CGA,LGA)
【标准号】:IEC61188-5-8-2007
【标准状态】:现行
【国别】:国际
【发布日期】:2007-10
【实施或试行日期】:
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC/TC91
【标准类型】:()
【标准水平】:()
【中文主题词】:应用;组装件;芯片;组件;设计;开发;尺寸;分立器件;电气工程;电子工程;电子设备;电子设备及元件;架设(施工作业);扁平接触表面;制造;包装件;印制电路板;耐力;表面安装设备;软钎焊连接;规范(验收);结构体系;辅助框架;表面安装
【英文主题词】:Applications;Assemblies;Chips;Components;Design;Developments;Dimensions;Discretedevices;Electricalengineering;Electronicengineering;Electronicequipment;Electronicequipmentandcomponents;Erecting(constructionoperation);Landpattern;Manufacturing;Packages;Printed-circuitboards;Resistance;SMD;Solderedjoints;Specification(approval);Structuralsystems;Subracks;Surfacemounting;Surfacemountingdevices
【摘要】:ThispartofIEC61188providesinformationonlandpatterngeometriesusedforthesurfaceattachmentofelectroniccomponentswithareaarrayterminationsintheformofsolderballs,soldercolumnsorprotectivecoatedlands.Theintentoftheinformationpresentedhereinistoprovidetheappropriatesize,shapeandtolerancesofsurfacemountlandpatternstoensuresufficientareafortheappropriatesolderjoint,andalsoallowforinspection,testingandreworkingofthosesolderjoints.Eachclausecontainsaspecificsetofcriteriasuchthattheinformationpresentedisconsistent,providinginformationonthecomponent,thecomponentdimensions,thesolderjointdesignandthelandpatterndimensions.Thelandpatterndimensionsarebasedonamathematicalmodelthatestablishesaplatformforasolderjointattachmenttotheprintedboard.Theexistingmodelscreateaplatformthatiscapableofestablishingareliablesolderjointnomatterwhichsolderalloyisusedtomakethatjoint(lead-free,tinlead,etc.).Processrequirementsforsolderreflowaredifferentdependingonthesolderalloyandshouldbeanalyzedsothattheprocessistakingplaceabovetheliquidustemperatureofthealloy,andremainsabovethattemperatureasufficienttimetoformareliablemetallurgicalbond.Areaarraylandpatternsdonotuse"landprotrusion"conceptsandattempttomatchthecharacteristicsofthephysicalanddimensionalterminationproperties.
【中国标准分类号】:L30
【国际标准分类号】:31_180
【页数】:30P;A4
【正文语种】:英语